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MEMS MICROPHONES – A GLOBAL TECHNOLOGY, INDUSTRY AND MARKET ANALYSIS UPDATE
(View Introduction/Table Of Contents)
Publish Date: Jan 2013,   Pages: 113,   Report Code: ET-118
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1. INTRODUCTIONix-xiv
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INTRODUCTION ........................................................................................................................................ ix
STUDY GOALS AND OBJECTIVES...………………………………......……………………………….............X
REASONS FOR DOING THE STUDY.........................................................................................................XI
CONTRIBUTIONS OF THE STUDY............................................................................................................xi
SCOPE AND FORMAT...............................................................................................................................xii
METHODOLOGY........................................................................................................................................xii
INFORMATION SOURCES........................................................................................................................XII
AUDIENCES FOR THE STUDY.................................................................................................................xiii
AUTHOR’S CREDENTIALS........................................................................................................................xiv

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2. EXECUTIVE SUMMARYxv-xix
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EXECUTIVE SUMMARY ................................................................................................................................................ xv

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3. INDUSTRY OVERVIEW1-29
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INDUSTRY OVERVIEW ........................................................................................................................... 1
BACKGROUND OF MEMS MICROPHONES............................................................................................2
BACKGROUND OF MEMS MICROPHONES (CONTINUED)...................................................................3
MEMS MICROPHONE
CHIP............................................................................................................................................................4
MEMS ADVANTAGES .............................................................................................................................. 5
MEMS MICROPHONE APPLICATIONS AND MARKETS..........................................................................6
FIGURE 1 MEMS MICROPHONES MARKET SEGMENTS BY APPLICATION, 2012-2017 ................... 6
MOBILE PHONES, PDAS, DIGITAL CAMERAS, CAMCORDERS .......................................................... 7
MOBILE PHONES, PDAS, DIGICAMS, CAMCORDERS (CONTINUED) ................................................ 8
MOBILE PHONES, PDAS, DIGICAMS, CAMCORDERS (CONTINUED) ................................................ 9
TABLE 1 FORECAST FOR MEMS MICROPHONES IN MOBILE PHONES AND DIGITAL
CAMERAS ............................................................................................................................................... 10
LAPTOPS ................................................................................................................................................ 10
LAPTOPS (CONTINUED).........................................................................................................................11
TABLE 2 MARKET FOR MEMS MICROPHONES IN LAPTOPS, 2012 AND 2017 ................................ 12
AUTOMOTIVE HANDS-FREE COMMUNICATION SYSTEMS............................................................... 12
AUTOMOTIVE HANDS-FREE COMMUNICATION SYSTEMS (CONTINUED).......................................13
AUTOMOTIVE HANDS-FREE COMMUNICATION SYSTEMS (CONTINUED) ..................................... 14
AUTOMOTIVE HANDS-FREE COMMUNICATION SYSTEMS (CONTINUED) ..................................... 15
TABLE 3 FORECASTED USE OF MEMS MICROPHONES IN AUTOMOTIVE HANDS-FREE
COMMUNICATION SYSTEMS, 2012 AND 2017 ................................................................................... 16
HEARING AIDS ....................................................................................................................................... 16
HEARING AIDS (CONTINUED).............................................................................................................. 17
TABLE 4 FORECASTED USE OF MEMS MICROPHONES IN HEARING AIDS, ................................ 18
INDUSTRY STRUCTURE.......................................................................................................................18
INDUSTRY STRUCTURE (CONTINUED)...............................................................................................18
TABLE 5 FOUNDRIES WITH MEMS MICROPHONE MANUFACTURING
CAPABILITIES IN 2012...........................................................................................................................20
INDUSTRY DYNAMICS AND GLOBAL MARKET..................................................................................20
MARKET ACCORDING TO TECHNOLOGY ......................................................................................... 21
ONE-CHIP CMOS-MEMS TECHNOLOGY FOR MICROPHONES ....................................................... 21
ONE-CHIP CMOS-MEMS TECHNOLOGY FOR MICROPHONES (CONTINUED) .............................. 22
ONE-CHIP CMOS-MEMS TECHNOLOGY FOR MICROPHONES (CONTINUED) .............................. 23
FIGURE 2 SINGLE-CHIP DESIGN OF MEMS MICROPHONES .......................................................... 24
TWO-CHIP TECHNOLOGY FOR MICROPHONES .............................................................................. 24
FIGURE 3 TWO-CHIP DESIGN OF MEMS MICROPHONES ............................................................... 25
TABLE 6 SUMMARY OF GLOBAL MARKET FOR MEMS MICROPHONES BY TECHNOLOGY,
2012 AND 2017 ...................................................................................................................................... 26
FIGURE 4 PERCENTAGE SHARE OF GLOBAL MARKET FOR MEMS MICROPHONES BY
TECHNOLOGY, 2012 AND 2017........................................................................................................... 26
MARKET ACCORDING TO APPLICATIONS ........................................................................................ 27
TABLE 7 SUMMARY OF GLOBAL MARKET FOR MEMS MICROPHONES BY APPLICATION,
2012 AND 2017 ....................................................................................................................................... 28
FIGURE 5 PERCENTAGE SHARE OF GLOBAL MARKET FOR MEMS MICROPHONES BY
APPLICATION, 2012 AND 2017 .............................................................................................................. 28
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4. TECHNOLOGY OVERVIEW30-66
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TECHNOLOGY OVERVIEW ......................................................................................................................... 30
MICROPHONE TYPES AND CHARACTERISTICS ..........................................................................................30
AUDIO MICROPHONES .................................................................................................................................... 30
CONDENSER MICROPHONES ........................................................................................................................ 31
UNIDIRECTIONAL AND OMNIDIRECTIONAL MICROPHONES ...................................................................... 31
UNIDIRECTIONAL AND OMNI-DIRECTIONAL MICROPHONES (CONTINUED) ............................................ 32
MEMS MICROPHONES ..................................................................................................................................... 33
TABLE 8 FORMULAS USED TO DEFINE AUDIO QUALITY/CHARACTERSTICS OF MICS.............................34
TABLE 8 (CONTINUED)...................................................................................................................................... 35
MICROMACHINING TECHNOLOGY.......................................................................................................... 36
TYPES OF MICROPHONES.......................................................................................................................... 36
CAPACITIVE MICROPHONES................................................................................................................................ 36
PIEZORESISTIVE MICROPHONES......................................................................................................................... 37
PIEZOELECTRIC MICROPHONES.......................................................................................................................... 37
OPTICAL MICROPHONES....................................................................................................................................... 37
FET MICROPHONES................................................................................................................................................. 37
TYPICAL FABRICATION PROCESSES................................................................................................................... 37
MEMS MICROPHONE FABRICATION...................................................................................................................... 38
FIGURE 6 PROCESSING STEPS FOR CMOS-MEMS MICROPHONES.................................................................. 39
FIGURE 7 LAYOUT OF SERPENTINE MESH DESIGN SHOWING
TWO UNIT CELLS IN A MEMS MICROPHONE.......................................................................................................... 39
TABLE 9 PROCESSES FOLLOWED BY MAJOR PRODUCERS IN FABRICATING MEMS MICROPHONES 40
TABLE 9 (CONTINUED)........................................................................................................................................ 41
TABLE 9 (CONTINUED)........................................................................................................................................ 42
TABLE 9 (CONTINUED)........................................................................................................................................ 43
TABLE 9 (CONTINUED)........................................................................................................................................ 44
WAFER FABRICATION VIA ETCHING................................................................................................................. 45
DRY ETCHING IN MEMS MANUFACTURING..................................................................................................... 46
DRY ETCHING IN MEMS MICROPHONES (CONTINUED)................................................................................. 47
WET ETCHING IN MEMS MICROPHONES.......................................................................................................... 48
WET ETCHING IN MEMS MICROPHONES (CONTINUED)............................................................................... 49
TABLE 10 KEY TERMINOLOGIES USED IN MANUFACTURING OF MEMS MICROPHONES........................ 50
TABLE 10 KEY TERMINOLOGIES IN MANUFACTURING OF MEMS MICROPHONES (CONTINUED)........... 51
TABLE 10 KEY TERMINOLOGIES IN MANUFACTURING OF MEMS MICROPHONES (CONTINUED) ..........52
COMPARING MEMS AND INTEGRATED CIRCUIT FABRICATION PROCESSES........................................... 52
COMPARING MEMS AND INTEGRATED CIRCUIT FABRICATION PROCESSES (CONT'D)..........................53
COMPARING MEMS AND INTEGRATED CIRCUIT FABRICATION PROCESSES (CONT'D)...........................54
PACKAGING........................................................................................................................................................ 55
TABLE 11 KEY TERMINOLOGIES USED IN PACKAGING OF MEMS MICROPHONES.................................. 56
TABLE 11 KEY TERMINOLOGIES USED IN PACKAGING OF MEMS MICROPHONES (CONTINUED).......... 57
MANUFACTURING: MEMS MICROPHONE BENEFITS FROM IC CHIP PROCESS......................................... 58
MANUFACTURING ON THE PRINCIPLE OF IC CHIP MANUFACTURING (CONTINUED).............................. 59
TABLE 12 TECHNOLOGY USED BY MANUFACTURERS OF SURFACE-MOUNTABLE,
CHIP-SIZE PACKAGING FOR MEMS MICROPHONES..................................................................................... 60
TABLE 13 CHARACTERISTICS OF COMMERCIALLY AVAILABLE MEMS MICROPHONES........................... 61
ELECTRONIC CHIP INTEGRATION IN MEMS MICROPHONES........................................................................ 61
TABLE 14 KEY TERMINOLOGIES USED TO DEFINE TYPES OF ELECTRONIC CIRCUITS
INTEGRATED IN MEMS MICROPHONES.......................................................................................................... 62
MEMS MICROPHONE CONSTRUCTION............................................................................................................ 62
DIAPHRAGMS...................................................................................................................................................... 62
AIR GAP................................................................................................................................................................ 63
CHARACTERISTICS OF MEMS MICROPHONES............................................................................................... 63
CURRENT MATERIALS USED IN MEMS MICROPHONES................................................................................ 63
FABRICATION TECHNIQUES.............................................................................................................................. 64
FABRICATION TECHNIQUES (CONTINUED)...................................................................................................... 65
SURFACE ACTIVITY............................................................................................................................................. 66
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5. INDUSTRY STRUCTURE AND MARKETS 67-73
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INDUSTRY STRUCTURE AND MARKETS ................................................................................................. 67
COMPETITIVE INNOVATION TRENDS....................................................................................................... 68
TABLE 15 COMPANY PRODUCT REFERENCE FOR MEMS MICROPHONES......................................... 69
TABLE 16 WORLD MARKET FOR MEMS MICROPHONE MANUFACTURERS........................................ 70
PARTNERSHIPS AND CONSOLIDATIONS................................................................................................. 70
TABLE 17 ACQUISITIONS AND COLLABORATIONS AMONG MANUFACTURERS OF
MEMS MICROPHONES FROM 2000 TO 2012............................................................................................. 71
REGIONAL MARKET.................................................................................................................................... 72
TABLE 18 SUMMARY OF GLOBAL MARKET FOR MEMS MICROPHONES BY REGION........................ 72
FIGURE 8 REGIONAL PERCENTAGES OF MARKET SHARE FOR MEMS MICROPHONES IN 2012 AND 2017......................................... 72
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6. PATENTS AND PATENT ANALYSIS74-92
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PATENTS AND PATENT ANALYSIS......................................................................................................... 74
LIST OF PATENTS...................................................................................................................................... 74
MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) DEVICE.......................................................................... 74
MEMS MICROPHONE AND METHOD FOR MANUFACTURING THE SAME...................................................... 75
MEMS MICROPHONE, PRODUCTION METHOD AND METHOD FOR INSTALLING......................................... 75
MEMS MICROPHONE WITH SINGLE POLYSILICON FILM.................................................................................. 75
COMPONENT COMPRISING A MEMS MICROPHONE AND METHOD FOR THE
PRODUCTION OF SAID COMPONENT................................................................................................................. 76
MICROPHONE WITH BACKSIDE CAVITY THAT IMPEDES BUBBLE FORMATION............................................ 76
MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) PACKAGE........................................................................ 76
PACKAGING STRUCTURE AND METHOD OF A MEMS MICROPHONE............................................................ 77
ELECTRICAL MODULE COMPRISING A MEMS MICROPHONE.......................................................................... 77
MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) MICROPHONE AND
METHOD OF MANUFACTURING THE SAME......................................................................................................... 77
MEMS MICROPHONE WITH CAVITY AND METHOD THEREFOR........................................................................ 78
MEMS DEVICE WITH SURFACE HAVING A LOW ROUGHNESS EXPONENT.................................................... 78
CONDENSER MICROPHONE AND PACKAGING METHOD FOR THE SAME...................................................... 78
METHOD OF FABRICATING AN ULTRA-SMALL CONDENSER MICROPHONE.................................................. 79
MICROPHONE WITH REDUCED PARASITIC CAPACITANCE.............................................................................. 79
MEMS MICROPHONE PACKAGE WITH RF INSENSITIVE MEMS MICROPHONE CHIP................................ 79
METHOD OF FABRICATING MICRO-ELECTROMECHANICAL SYSTEM MICROPHONE STRUCTURE....... 80
MEMS DEVICE AND METHOD FOR FABRICATING THE SAME...................................................................... 80
CARD TYPE MEMS MICROPHONE.................................................................................................................... 80
CALIBRATED MICROELECTROMECHANICAL MICROPHONE........................................................................ 81
ALTERNATIVE SENSING CIRCUIT FOR MEMS MICROPHONE AND SENSING METHOD THEREOF.......... 81
METHOD FOR PACKAGING MICRO ELECTROMECHANICAL SYSTEMS MICROPHONE.............................. 81
MICROPHONE APPARATUS...................................................................................................................................................... 82
INTEGRATED AUDIO CODEC WITH SILICON AUDIO TRANSDUCER.......................................................... 82
PACKAGE AND PACKAGING ASSEMBLY OF MICROELECTROMECHANICAL SYSTEM MICROPHONE. 82
SYSTEM AND METHOD TO PROVIDE RF SHIELDING FOR A MEMS MICROPHONE PACKAGE.............. 83
SILICON BASED CONDENSER MICROPHONE AND PACKAGING METHOD FOR THE SAME.................. 83
MEMS MICROPHONE PACKAGE AND METHOD THEREOF......................................................................... 83
OPTICAL SENSING IN A DIRECTIONAL MEMS MICROPHONE.................................................................... 84
CHIP-SCALED MEMS MICROPHONE PACKAGE........................................................................................... 84
MEMS MICROPHONE MODULE AND METHOD THEREOF........................................................................... 84
LEADFRAME PACKAGE FOR MEMS MICROPHONE ASSEMBLY.................................................................. 85
PACKAGE STRUCTURE OF MEMS MICROPHONE........................................................................................ 85
MEMS MICROPHONE WITH A STACKED PCB PACKAGE AND METHOD OF PRODUCING THE SAME.... 86
MICROELECTROMECHANICAL SYSTEM MICROPHONE FABRICATION INCLUDING
SIGNAL PROCESSING CIRCUITRY ON COMMON SUBSTRATE.................................................................... 86
MEMS MICROPHONE......................................................................................................................................... 86
INDUCTOR-BASED MEMS MICROPHONE........................................................................................................ 87
MICROPHONE SYSTEM FOR A COMMUNICATION DEVICE........................................................................... 87
PATENT ANALYSIS............................................................................................................................................ 88
TABLE 19 NUMBER OF U.S. PATENTS GRANTED TO COMPANIES
MANUFACTURING MEMS MICROPHONES FROM 2007 THROUGH 2012...................................................... 89
PATENT ANALYSIS ACCORDING TO REGIONS............................................................................................... 90
TABLE 20 NUMBER OF U.S. PATENTS GRANTED BY ASSIGNED COUNTRY/REGION
FOR MEMS MICROPHONES FROM JAN. 2007 TO 2012.................................................................................. 90
FIGURE 9 U.S. PATENTS GRANTED FOR MEMS MICROPHONES BY REGION FROM 2007 TO 2012........ 91

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7. COMPANY PROFILES 93-113
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$525.00
COMPANY PROFILES................................................................................................................... 93
ADVANCED SEMICONDUCTOR ENGINEERING, INC. (ASE GROUP)....................................... 93
AKUSTICA, INC................................................................................................................................. 93
AAC TECHNOLOGIES.......................................................................................................................  96
AMKOR TECHNOLOGY, INC. ..........................................................................................................  97
ANALOG DEVICES, INC. ...................................................................................................................  97
CARNEGIE MELLON UNIVERSITY (CMU) ....................................................................................  98
DELPHI TECHNOLOGIES INC. .....................................................................................................  100
EPCOS AG.......................................................................................................................................... 100
FORTEMEDIA, INC. .......................................................................................................................  101
INFINEON TECHNOLOGIES AG................................................................................................... 101
INSTITUTE OF MICROELECTRONICS.......................................................................................  102
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (ITRI) .................................................  103
JL WORLD....... .................................................................................................................................  103
KNOWLES ACOUSTICS..................................................................................................................  104
MEMES TECHNOLOGY BHD (MEMSTECH) ..............................................................................  106
MEMES TECHNOLOGY BHD (CONTINUED)........................................................................................... 107
MOTOROLA, INC................................................ .............................................................................  108
NATIONAL SEMICONDUCTOR....................................................................................................  108
SAMSUNG ELECTRONICS CO. LTD. ......................................................................................... 109
SONION A/S.................................................................................................................................... 109
SYMPHONIX DEVICES, INC./MED-EL......................................................................................... 112
THE RESEARCH FOUNDATION OF THE STATE UNIVERSITY OF NEW YORk.................. 112
UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INC................................................... 113
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